Topology optimization of 2.5D heat sink
| Date | |
|---|---|
| Tags | COMSOLStudyTopology Optimization |
| Author |  Henry |
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Topology optimization of silicon-based thermal management devices using COMSOL Multiphysics
Two-layer heat sink model
Applied same model from Topology optimization of microchannel heat sinks using a two-layer model.
Boundary conditions
Optimized designs, velocity magnitude, design layer middle plane temperature Tt and substrate layer middle plane temperature Tb with ΔP = 10, 50, 200Pa using a two-layer model
Comparison between reference heat sink design and optimized design for ΔP = 50Pa
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The performance of the reference heat sink and optimized heat sink were compared in above Figure. The mid-plane substrate temperature for the reference heat sink is 26.8◦C whereas the optimized design is 6.39◦C, the performance improved over 319%.